Super High-Power Thermal Test Vehicle (TTV) Chip for OAM

Next-Gen Thermal  Solution for AI Servers, GPUs & DPUs

The brand new Super High-Power TTV for OAM by KLC is engineered to meet the thermal testing demands of next-generation AI Server and GPU.  Designed specifically for Open Accelerator Modules (OAM) used in GPUs, AI chips, DPUs, and CPUs, this cutting-edge tool simulates thermal loads with a super high power density of up to 500 W/cm². It’s the ideal thermal solution for testing liquid cooling systems, immersion cooling systems,  cold plates  and heatsinks, and Cooling Distribution Units (CDUs) ensuring optimal performance and reliability in high-performance computing (HPC), machine learning (ML), deep learning (DL), and cloud data centers.

As AI transforms industries, the need for robust hardware accelerators with efficient power, cooling, and maintainability grows.  The Super High-Power TTV addresses these challenges by offering precise thermal simulation, compatibility with diverse PCB layouts, and seamless integration into existing test platforms—making it a must-have for labs and enterprises developing innovative cooling technologies.

Key Features

• Super High Power Density Simulation: Accurately replicates thermal loads of high-performance chips (e.g., AI chips, HPC GPUs, CPUs) with up to 500 W/cm² power density.
• Liquid-Cooling & Immersion Cooling Ready: Tailored for testing Liquid cooling systems and immersion cooling setups, with high-precision temperature control for reliable results.
• Temperature Protection: Features real-time temperature detection and feedback, pausing tests if cooling capacity is insufficient to prevent equipment damage.
• High-Precision Temperature Control: Ensures precise thermal simulation suitable for advanced semiconductor packaging and cooling system testing environments.

Product Advantages

• Realistic simulation of AI chip heat profiles

• Eliminates the risk of damaging expensive processors

• Speeds up R&D cycles for server and rack manufacturers

• Enables early-stage validation of thermal solutions

Application Scenarios

• OAM Modules for AI GPUs
  Ensure high-load stability with precise thermal emulation.

• AI Servers & DPU Platforms
  Test reliability and performance of cooling systems under realistic conditions.

• TTV on UBB (Universal Baseboard)
  Evaluate different board layouts and cooling designs.

• Cold Plate Development
  Optimize cold plate and heatsink designs for OAM modules.

Technical Specifications

• Cooling Systems Supported: Liquid cooling and immersion cooling systems.
• Maximum Power Density  up to  500 W/cm², available upon request.
• For More Specs: Contact us at info@ptc-heater.com.tw.

Why Choose KLC’s Super High-Power TTV?

• Its Super high power density, precision temperature control, and versatile applications, the Super High-Power TTV for OAM is a game-changer in cooling system testing.

• Versatile Applications
  Perfect for testing cold plates, heatsinks, liquid cooling, immersion cooling, and full cooling distribution units (CDUs).

• Cost Reduction
  Eliminates the need to use expensive AI processors during the R&D and validation stages.

• Faster Development Cycles
  Allows earlier testing and optimization of thermal systems — no need to wait for chip available.

• Accelerates Innovation
  Empowers thermal engineers and system designers to prototype, validate, and launch solutions more efficiently.

• Competitive Edge
  Helps businesses deliver optimized, high-performance cooling systems faster — gaining an edge in the AI and data center market.

Get Started Today!

Elevate your thermal management and lead the way in AI, GPU and DPU innovation!